RIFA ADVANCED MATERIALS

EPOXY MOLDING COMPOUNDS (Panasonic)

Two or more epoxy groups in one molecule are a generic name of a resin, a curing agent and a catalyst in the presence of 3D-curable resin is a relatively small molecular weight.

Characteristics by usage

1. Automotive housing

Applications : Automotive smart card key outside of molding.

Grade			Test Method	Unit	Recommend
Electrical properties	Volume resistivity	20℃	JIS K6911	Ω・cm	5.0×1016
		150℃	JIS K6911	Ω・cm	1.0×1013
		After moisture absorption		Ω・cm
	Withstand voltage		JIS K6911	MV/m
	Dielectric constant		JIS K6911		3.8
	Dissipation factor		JIS K6911		0.01
Physical properties	Flexural strength		JIS K6911	MPa	140
	Flexural modulus		JIS K6911	GPa	11
	Linear expansion coefficient			×10－5/ ℃	2.3
	Grass transition temperature			℃	155
	Molding shrinkage		JIS K6911	%	0.6
	Specific gravity		JIS K6911		1.8
	Thermal conductivity coefficient			W/m・K	0.6
	flammability		UL94		V-0
Extracted water	Electric conductivity			mS/m	< 10
	Na+			ppm	< 20
	Cl-			ppm	< 30
	PH				4~7
Moldability	Spiral flow170℃			cm	160~260
	Gel time 170℃			s	20~50
	viscosity 175℃			Pa・s	5~10
Molding condition	Molding temperature			℃	175~185
	Curing time			s	40~100s
	Molding pressure			MPa	4.9~9.9
	Aging temperature-Time			℃ - h	175-5
	Potlife			month（5℃）	6
Features			Moldability, rapid ultra low warpage, Br/Sb free
Applications			Memory, BGA, CSP

2. Semiconductor encapsulation

Characteristics : Low stress characteristic, soldering heat resistance, low warpage, High Tg, high heat conductivity, etc.

Applications : DIP, SOP, TSOP, SOJ, QFP

3. Liquid encapsulation

Characteristics : High-speed filling performance, low substrate warpage, low stress characteristic, high adhesiveness, soldering heat resistance, etc.

Applications : - Target board : Glass Epoxy, Ceramics, Polyimide
- Target Package : COB, CSP/BGA, C-CSP, C-MCM, Flip-Chip

4. Transparent encapsulation

Characteristics : Stain removal performance of mold, shortening the cleaning cycle time.

Applications : LED , IR , PDIC